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M5 Pro & M5 Max Feature Vertically Stacked Dies That Mimic 3D Packaging, According To Apple’s Platform Architecture Employee, Enabling Unrivaled Performance

An Apple employee states that the M5 Pro and M5 Max sport a new chiplet design where the dies are stacked vertically on top of one another Apple’s new ‘Fusion Architecture’ was utilized for the first time when the company unveiled the M5 Pro and M5 Max, enabling the two SoCs to sport a unique chiplet design that is more advanced than the monolithic architecture that has been incorporate... [2638 chars]

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