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CanSemi Tech Joins China Chip IPO Wave With $919 Million Deal

Verified report from bloomberg.com

NewsMatic brief

Chinese chip foundry CanSemi Technology Inc. is seeking to raise about 6.16 billion yuan ($919 million) in an initial public offering on the Shenzhen stock exchange’s ChiNext board, joining a growing list of companies in the industry capitalizing on Beijing’s drive for tech self-reliance.

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Read the full report at bloomberg.com

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